M.S. Theses (Professional Master Program)
- Mr. Yeh (1999/9-2001/6), Hoshin Management: A Case Study
- Mr. Peng (1999/9-2001/7), The Application of Taguchi Method to Improve the Score Line Corrosion for Full Aperture Tinplate Easy-Open-Ends
- Mr. Wu (1999/9-2001/7), The TL 9000 implementation and case study
- Mr. Chang (1999/9-2002/1), Application of Taguchi Methods to Improve the Semiconductor Packaging Process—A Case Study for Wire Strength Optimization of Wire Bonding Process
- Mr. Chiu (1999/9-2002/7, Improvement of Crystal Pulling Process in Wafer Fabrication by the Taguchi Methods
- Mr. Lee (1999/9-2002/7), Application of Taguchi Methods to Improve the Ball Grid Array Substrate Process
- Mr. Chao (2001/9-2003/6), Improve IC Assembly Process Quality through the Six Sigma Approach
- Mr. Yu (2001/9-2003/6), Improvement of the Note Book Computer Testing Process Using MTS
- Mr. Yeh (2001/9-2003/6), Marketing for Six Sigma--The Case of Semiconductor Package/Test
- Mr. Hsu (2001/9-2003/6), Application of Taguchi Methods to Improve the Response Time of LCD
- Mr. Chen (1999/9-2004/4), Using Neural Networks for Die Pad Discoloration Detection
- Mr. Lin (2002/9-2004/8), Apply Taguchi Methods to the Digital Scanner Transmitting Noises and Imaging Position Problems
- Mr. Yu (2002/9-2005/10), DFSS in ODM Electronic Product Development—A Case Study of Wireless Communication Product
- Mr. Hu (2001/9-2005/12), Application of Taguchi Methods to Reduce Misjudgement of Wireless Network Card Power Test Equipment
- Ms. Wu (2000/9-2007/1), The Forecasting of Cash Withdrawals from ATM by Using Artificial Neural Network
- Mr. Kong (2001/9-2007/10), Reducing Test Items of TFT-LCD Product By Using Neural Networks
- Mr. Lin (2001/9-2008/7), Application of Taguchi Methods to Improve the Performance of Coordinate Measuring Machine
- Mr. Lo (2001/9-2008/7), Improve Performance of Inventory Management through Lean Six Sigma
- Mr. Hsieh (2005/9-2008/12), Forecasting Transmission Efficiency of WLAN Product by Using Back-Propagation Neural Networks
- Ms. Yeh (2005/9-2008/12), Process Optimization by Taguchi Methods: A Case Study of Light Emitting Diode Manufacturing Process
- Mr. Chen (2006/9-2008/12), Application of Taguchi Methods to Optimize the Parameter of Polishing Process
- Mr. Huang (2005/9-2009/4), Research on Critical Factors of Unnatural Control Chart Patterns--A Case Study of Lithography Process in LTPS TFT LCD
- Mr. Lin (2006/9-2009/7), Improve Wafer Sort Yield in Assembly House Through Six Sigma
- Mr. Liu (2007/9-2009/7), Applying Six Sigma Methodology to Improve Bending Strength of Small and Medium Sized TFT LCD
- Mr. Yang (2005/9-2009/11), Outsourcing Management Research: A Case Study of IC Equipment Preventive Maintenance
- Mr. Chang (2006/9-2009/11), Motor Noise Problem Improvement by Six Sigma Approach
- Mr. Hsueh (2003/9-2010/6), Machining Center Process Optimization by Taguchi Methods: A case Study of Quartz Glass Surface Manufacturing Process
- Mr. Teng (2008/9-2010/6), Six Sigma Project Selection for PCB industry
- Mr. Lin (2009/9-2010/6), Optimization of the Optical Whiteness Ratio for Flexible Display by Using Taguchi methods
- Mr. Hsu (2006/9-2011/4), Application of the Kano Model for Analyzing the Quality Attributes of Backlight Unit of TFT-LCD
- Mr. Chang (2007/9-2011/4), Improving Malfunction of Wired Power Jack Connector Through Six Sigma
- Mr. Wu (2004/9-2011/7), Apply Six Sigma approach to improve the Backend process yield of LED
- Mr. Lin (2006/9-2011/12), Enhancing Yield Rate of Connector Manufacturing Process by Using Six Sigma DMAIC Methodology
- Mr. Chen (2004/9-2011/12), The Application of Themed Surveillance in ISO 9000 Quality Management System--A Case Study
- Mr. Hsu (2010/9-2012/4), Improve PCB Inner Layer Open Circuit Through Six Sigma
- Mr. Chang (2005/9-2012/5), The Study on the Cost Systems of Wafer Fabrication Plants
- Ms. Chen (2010/9-2012/5), The Development and Application of Design Change Processes in New Product development
- Mr. Teng (2010/9-2012/5), Combining FMEA and Taguchi Methods to Improve the Reliability of electronic Paper Display
- Mr. Su (2009/9-2012/7), LCD-TV Color Shift Improvement by DFSS Approach
- Mr. Chu (2011/9-2014/6), Improve Delamination Problem of NanD Flash IC Package by Using Six Sigma Methodology
- Mr. Hsueh (2012/9-2014/6), An Analysis on Outsourcing Decision for the TFT-LCD Optical Films Cutting Process
- Mr. Hu (2012/9-2014/7), Improvement of the Product Development Process—A Case of Smartphone Manufacturing
- Ms. Chiang (2012/9-2014/12), Using Six Sigma to improve IC carrier finger nodule problem
- Mr. Chien (2012/9-2014/12), One-piece flow manufacturing for computer peripherals industry
- Ms. Fang (2011/9-2015/5), Using Design for Six Sigma DMADV Methodology to Improve Retest Rate of WiFi Product
- Mr. Huang (2011/9-2015/5), Applying Six Sigma DMAIC to improve Ball Shear in Bumping Process
- Mr. Wang (2013/9-2015/5), A Case Study of New Product Development Process Enhancement for Storage System
- Mr. Chen (2014/9-2015/6), Application of IC Test Program Setup Using Neural Network
- Mr. Chien (2014/9-2015/12), Six Sigma Certification Rate Improvement: Case Study
- Mr. Shih (2013/9-2016/6), Predicting the Sn-Ag solder plating parameters by back propagation neural network
- Ms. Lu (2014/9-2016/6), Applying SERVQUAL and IPA to Evaluate Customer Audit Service Quality –A Case Study of Semiconductor Assembly House
- Mr. Su (2014/9-2017/7), Application of QC Story to Improve the Cell Quality of Printing Process-A Case Study of N Company for the Solar Cell Industry
- Mr. Huang (2015/9-2017/7), Throughput improvement in Wafer Outgoing flow by Lean Six Sigma
- Mr. Wang (2015/9-2017/7), Improvement of the Compressive Strength of Sapphire Double-sided Polishing Wafer Using Six Sigma DMAIC: A Case Study
- Mr. Lai (2015/9-2017/7), Improvement of Integrated-Circuit Substrate Short Failure Issue using Ford Eight Disciplines Methodology
- Mr. Hung (2015/9-2017/7), Attractive Quality Creation: A Case Study for the Silicon Thin Film Photovoltaic
- Mr. Wang (2016/9-2017/9), Improvement of Potential Induced Degradation on Cell-Level in P-Type-Poly Si Solar Cell Process
- Ms. Chung (2015/9-2018/1), Yield Improvement of Photo Engraving Process in TFT-LCD Using Six Sigma Methodology
- Mr. Liu (2016/9-2018/6), Forecasting Business Profitability by Using Multiple Regression Analysis and Back-propagation Neural Network
- Ms. Li (2016/9-2018/6), Implementation of MFMEA in Semiconductor Manufacturing Equipment: A Case Study
- Mr. Yang (2016/9-2018/10), The Improvement of Lithium Battery Module Thermal Runaway Using Six Sigma Methodology
- Ms. Chen (2016/9-2018/10), Improving the Surface Roughness of the Polishing Pad Groove Using Six Sigma
- Mr. Huang (2017/9-2019/6), Applying Lean Six Sigma to Improve Animal Experiment Process Cycle Time: A Case Study